High-Speed Circuit Board Signal Integrity

High-Speed Circuit Board Signal Integrity (Artech House Microwave Library) 

Book Description

February 26, 2004 1580531318 978-1580531313
ContentsCharacteristics and Construction of Printed Wiring Boards. Resistance of Etched Conductors. Capacitance of Etched Conductors. Inductance of Etched Conductors. Transmission Lines. Return Paths and Split Planes. Signal Attenuation, Equalization, and Loss Calculations. Differential Impedance and Crosstalk. Microstrip and Stripline Characteristics. SMT Capacitors. Special Topics.

About the Author

Stephen C. Thierauf served as senior consulting hardware engineer at Fabric Networks, Inc. While working at Compaq Computers and Digital Equipment Corporation, he was a senior member of the technical staff responsible for the design and signal integrity analysis of high-speed I/O circuitry and interconnect on the ALPHA microprocessor. Formerly a visiting scholar at Northeastern University, he holds a B.S. in engineering technology from Wentworth College of Technology, Boston, MA.